I*oduction Die Attach Paste ”KEMITITE CT285” is epoxy resin based and solvent free Type paste. The highest thermal conductivity (25W/mK) Good reflow performance due lower moisture absorption resin system. CT285 is effectively used for power IC, transistor. Features1） Good workability for dispensing due to solvent free and one liquid type paste. 2） Highest thermal conductivity(25W/mK) 3） Bleed less. General PropertyProperties Unit Typical Value Test Method Appearance – Silver Filled Paste Visual Viscosity at 25CPa·s100EHD Viscometer 0.5rpm3°cone) Thixotropic Index –6.0 0.5rpm/2.5rpm Non Voletile Wt%92.0 180C×2hr Silver Content Wt%87.5 600C×3hr Adhesive Strength 25c300CN3020 Frame: Cu/PPF Chip Size: 2×2mm Volume Resistivity Ohm.cm 8×10-6 Cure: 200C×90min Measurement: Room Temp Glass Transition Temperature C200TMA Modulus(25C) 25CGPa16.5DMA 260C 7.8 CTE Alpha 1Ppm75TMA Alpha 2 200 Ionic Impurity Nappm61 Atomic AbsorptionIonchromatography CIThermal Conductivity W/m K25 Laser Flash4. Standard Cure Condition175C×60-90min 5. RemarksStorage condition is _30 to _15C 6 month 标签： 深圳市大功率导电银胶 深圳市大功率导电银胶厂家 广东 深圳市深圳市大功率导电银胶厂家 供应CT285大功率LED导电银胶
雷德机电（深圳）有限公司
